creat by art - low power loss, high efficiency - ideal for automated placement - guardring for overvoltage protection - high surge current capability - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free base p/n with prefix "h" on packing code - aec-q101 qualified terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test with prefix "h" on packing code meet jesd 201 class 2 whisker test v rrm 20 30 40 50 60 90 100 150 200 v v rms 14 21 28 35 42 63 70 105 140 v v dc 20 30 40 50 60 90 100 150 200 v i f(av) a dv/dt v/ s t j o c t stg o c document number: d1307007 version: l13 - 55 to +150 5 i r v f maximum average forward rectified current r jl r ja 0.75 0.85 o c/w 17 50 120 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm - voltage rate of change (rated v r ) 10000 0.5 - maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage v a maximum instantaneous forward voltage (note 1) i f = 5 a 0.95 0.55 note 1: pulse test with pw=300 s, 1% duty cycle operating junction temperature range storage temperature range ma - maximum reverse current @ rated vr t j =25 t j =100 t j =125 20 10 0.3 typical thermal resistance sk52c thru sk520c surface mount schottk y barrier rectifier taiwan semiconductor mechanical data - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec - moisture sensitivity level: level 1, per j-std-020 features s k 55c s k 59c polarity: indicated by cathode band maximum ratings and electrical characteristics (t a =25 unless otherwise noted) s k 53c symbol s k 520c unit s k 510c s k 56c - 55 to +150 weight: 0.21 g (approximately) do-214ab (smc) case: do-214ab (smc) 5 s k 54c s k 52c parameter s k 515c
part no. part no. sk56c sk56c sk56c (ta=25 unless otherwise noted) document number: d1307007 version: l13 r7 g green compound green compound code description sk56c r7 hr7 3,000 / 13" plastic reel note 1: "xx" defines voltage from 20v (sk52c) to 200v (sk520c) example prefix "h" r7 packing code sk56c r7g r6 smc r7 3,000 / 13" paper reel m6 ratings and characteristics curves sk56chr7 smc aec-q101 qualified preferred p/n aec-q101 qualified sk5xxc (note 1) suffix "g" smc 850 / 7" plastic reel sk52c thru sk520c ordering information aec-q101 qualified packing code green compound code package packing taiwan semiconductor 0 1 2 3 4 5 6 0 25 50 75 100 125 150 average forward a current (a) lead temperature ( o c) fig.1 forward current derating curve resistive or inductiveload 50 70 90 110 130 150 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2 maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method 0.001 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse a current (ma) percent of rated peak reverse voltage (%) fig. 4 typical reverse characteristics tj=25 tj=75 tj=125 sk52c-sk54c sk55c-sk520c 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 instantaneous forward a current (a) forward voltage (v) fig. 3 typical forward characteristics sk52c-sk54c sk55c-sk56c sk59c-SK510C sk515c-sk520c pulse width=300 s 1% duty cycle
min max min max a 2.90 3.20 0.114 0.126 b 6.60 7.11 0.260 0.280 c 5.59 6.22 0.220 0.245 d 2.00 2.62 0.079 0.103 e 1.00 1.60 0.039 0.063 f 7.75 8.13 0.305 0.320 g 0.10 0.20 0.004 0.008 h 0.15 0.31 0.006 0.012 p/n = specific device code g = green compound yw = date code f = factory code document number: d1307007 version: l13 0.268 0.173 0.370 marking diagram b2.5 c6.8 d4.4 suggested pad layout symbol unit (mm) a3.3 e9.4 unit (inch) 0.130 0.098 sk52c thru sk520c taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 10 100 1000 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance sk52c-sk54c s k 55c - s k 56c sk59c-sk520c f=1.0mhz vsig=50mvp-p 0.1 1 10 100 0.01 0.1 1 10 100 transient thermal impedance a ( /w) t-pulse duration(s) fig. 6 typical transient thermal impedance
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: d1307007 version: l13 sk52c thru sk520c taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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